Stress evolution in the metal layers of TSVs with Bosch scallops

We have studied the stress evolution in the tungsten film of a particular open TSV technology during the thermal processing cycle. The film is attached to the via’s wall, where scallops were observed as a result of the Bosch processing. Our work describes a scheme which considers the scallops on the TSV and conjugates a stress model for thin-films with the traditional mechanical FEM approach. The results reveal potential reliability issues and a specific evolution for the stress in the tungsten layer. Corresponding author [email protected] Tel: +43 1 58801-36027; Fax: +43-1-58801-36099 Presentation preference: Oral Stress Evolution in the Metal Layers of TSVs with Bosch Scallops A.P. Singulani * , H. Ceric, S. Selberherr